Farecla G Mop 8" Waffle Foam Compound Pad, CFW801
Farecla G Mop 8" Fast Cut Waffle Foam Compounding Pad features a waffle design to keep surface cool & holds liquid compounds and polish better.
Offers more cut than other foam pads yet still ideal for removing swirl marks and holograms.
Removes swirl marks and polishes to a higher gloss than wool pads. Easy water clean up and longer lasting when used with Farecla compounds
Features and Benefits:
- Waffle design keeps surface cooler & holds liquid compounds and wax better
- Hook & loop allows rapid fitting and removal from backing plate
- Removes swirl marks and polishes to a higher gloss than wool pads
- Easy water clean up and longer lasting when used with Farecla compounds
- 8" pad with grip hook & loop backing
- Dual layer foam for faster cut
- Fluted design keeps surface cool
- Use with most grip backing plates
- One pad per package